Zen 2
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| Produced | July 2019 |
|---|---|
| Designed by | AMD |
| Common manufacturer(s) |
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| Min. feature size | 7 nm[1][2] |
| Cores | up to 64 (server), up to 16 (desktop) |
| Socket(s) | |
| Predecessor | Zen+ |
| Successor | Zen 3[3][2] |
Zen 2 is the codename for a successor of AMD's Zen and Zen+ microarchitectures due to be fabricated on the 7 nanometer node from TSMC with product sampling planned for late 2018, followed by commercial release in July 2019, powering the third generation of Ryzen processors, known as Ryzen 3000 for the mainstream desktop chips, and Threadripper 3000 for high-end desktop systems.[4][5] At Computex 2019, AMD announced a product release date of July 7, 2019.[6]
Zen 2 is expected to bring an increase in instructions per clock over Zen, but not nearly as large as the jump from Excavator to Zen, and according to userbenchmark.com translates to about a [7]13% IPC uplift over Zen+.[8] At the 2018 Consumer Electronics Show (CES), AMD confirmed that Zen 2 design was complete; however, its release was not announced for 2018, leading analysts to predict a 2019 release date.[9]
Zen 2 is planned to include hardware mitigations to the Spectre security vulnerability.[10] Zen 2-based EPYC server CPUs (codename "Rome") use a design in which multiple CPU dies (up to eight in total) manufactured on a 7 nm process ("chiplets") are combined with a 14 nm I/O die on each MCM package. Through this, up to 64 physical cores and 128 total compute threads (with simultaneous multithreading) are supported per socket.[11] At 2019 CES, AMD showed a Ryzen third-generation engineering sample that contains one chiplet with eight cores and 16 threads.[4] Lisa Su also said to expect more than eight cores in the final lineup.[12] At Computex 2019 AMD revealed that the Zen 2 "Matisse" chips would feature up to 12 cores and a few weeks later a 16 core chip was also revealed at E3 2019.[13][14]
Design
Zen 2 is a significant departure from the physical design paradigm of AMD's previous Zen architectures, Zen and Zen+. Zen 2 moves to a multi-chip module design where the I/O components of the CPU are laid out on its own, separate die. This separation has benefits in scalability and manufacturability. As physical interfaces don't scale very well with shrinks in process technology, their separation into a different die allows these components to be manufactured using a larger, more mature process node than the CPU dies. The CPU dies (referred to by AMD as chiplets), now more compact due to the move of I/O components onto another die, can be manufactured using a smaller process with fewer manufacturing defects than a larger monolithic die would exhibit. In addition, the central I/O die can service multiple chiplets, making it easier to construct processors with a large number of cores.[15][16]
With Zen 2, each CPU chiplet houses 8 cores, arranged in two core complexes (CCX) of 4 cores each. These chiplets are manufactured using TSMC's 7 nanometer node and are about 74 to 80mm2 in size.[16] The chiplet has about 3.9 billion transistors, while the 12nm IOD is ~125mm2 and has 2.09 billion transistors. The amount of L3 cache has been doubled to 32 MiB, with each core on an 8-core chiplet now having access to 4 MiB of L3 compared to the 2 MiB of Zen and Zen+.[17] AVX2 is now fully supported, with an increase in execution unit width from 128-bit to 256-bit.[18]
There are multiple variants of the I/O die: one manufactured on GlobalFoundries 14 nanometer process, and another manufactured using the same company's 12 nanometer process. The 14 nanometer dies have more features and are used for the EPYC Rome processors, whereas the 12nm versions are used for consumer processors.[16]
New features
- Some new instruction set extensions: WBNOINVD, CLWB, RDPID.[19]
Products
On May 26, 2019, AMD announced six Zen 2 based desktop processors. These included 6-core and 8-core variants in the Ryzen 5 and Ryzen 7 product lines, as well as a new Ryzen 9 line that includes the company's first 12-core and 16-core mainstream desktop processors.[20]
AMD's 2nd generation of EPYC processors, known as Rome, will feature up to 64 cores and are expected to launch in the third quarter of 2019.[21]
Desktop processors
Template:AMD Ryzen 3000 Series
See also
 |
Wikimedia Commons has media related to Zen microarchitecture. |
- AMD K9
- AMD K10
- Epyc
- Jim Keller (engineer)
- Ryzen
- Steamroller (microarchitecture)
- Zen (microarchitecture)
- Zen+
References
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- ↑ https://www.heise.de/newsticker/meldung/AMD-Ryzen-3000-12-Kernprozessoren-fuer-den-Mainstream-4432392.html
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