Intel Core

This article is about the Intel processor brand name. For the Intel microarchitecture that is the basis for the Core 2 processor family, see Intel Core (microarchitecture).

File:Intel core i7-970 bottom IMGP5961 wp wp.jpg

Bottom of an Intel Core i7-970

File:Intel i5-2500.jpg

Top of an Intel Core i5-2500

Intel Core is a line of mid-to-high end consumer, workstation, and enthusiast central processing units (CPU) marketed by Intel Corporation. These processors displaced the existing mid-to-high end Pentium processors of the time, moving the Pentium to the entry level, and bumping the Celeron series of processors to low end. Identical or more capable versions of Core processors are also sold as Xeon processors for the server and workstation markets.

As of June 2017, the lineup of Core processors included the Intel Core i9, Intel Core i7, Intel Core i5, and Intel Core i3, along with the Y - Series Intel Core CPUs.

In early 2018, news reports indicated that security flaws, referred to as "Meltdown" and "Spectre", were found "in virtually all Intel processors [made in the past two decades] that will require fixes within Windows, macOS and Linux". The flaw also affected cloud servers. At the time, Intel was not commenting on this issue. According to a New York Times report, "There is no easy fix for Spectre ... as for Meltdown, the software patch needed to fix the issue could slow down computers by as much as 30 percent".

In mid 2018, the majority of Intel Core processors were found to possess a defect (the Foreshadow vulnerability), which undermines the Software Guard Extensions (SGX) feature of the processor.

Outline

Although Intel Core is a brand that promises no internal consistency or continuity, the processors within this family have been, for the most part, broadly similar.

The first products receiving this designation were the Core Solo and Core Duo Yonah processors for mobile from the Pentium M design tree, fabricated at 65 nm and brought to market in January 2006. These are substantially different in design than the rest of the Intel Core product group, having derived from the Pentium Pro lineage that predated Pentium 4.

The first Intel Core desktop processor—and typical family member—came from the Conroe iteration, a 65 nm dual-core design fabricated brought to market in July 2006, based on the all-new Intel Core microarchitecture with substantial enhancements in micro-architectural efficiency and performance, outperforming Pentium 4 across the board (or near to it), while operating at drastically lower clock rates. Maintaining high instructions per cycle (IPC) on a deeply pipelined and resourced out-of-order execution engine has remained a constant fixture of the Intel Core product group ever since.

The new substantial bump in microarchitecture came with the introduction of the 45 nm Bloomfield desktop processor in November 2008 on the Nehalem architecture, whose main advantage came from redesigned I/O and memory systems featuring the new Intel QuickPath Interconnect and an integrated memory controller supporting up to three channels of DDR3 memory.

Subsequent performance improvements have tended toward making addition rather than profound change, such as adding the Advanced Vector Extensions instruction set extensions to Sandy Bridge, first released on 32 nm in January 2011. Time has also brought improved support for virtualization and a trend toward higher levels of system integration and management functionality (making it faster the CPU) through the ongoing evolution of facilities such as Intel Active Management Technology.

Overview

Brand	Desktop				Mobile
	Code-named	Cores	Fab	Date released	Code-named	Cores	Fab	Date released
Core Solo	Desktop version not available				N/A	1	65 nm	January 2006
Core Duo	Desktop version not available				Yonah	2	65 nm	January 2006
Core 2 Solo	Desktop version not available				Merom-L Penryn-L	1 1	65 nm 45 nm	September 2007 May 2008
Core 2 Duo	Conroe Allendale Wolfdale	2 2 2	65 nm 65 nm 45 nm	August 2006 January 2007 January 2008	Merom Penryn	2 2	65 nm 45 nm	July 2006 January 2008
Core 2 Quad	Kentsfield Yorkfield	4 4	65 nm 45 nm	January 2007 March 2008	Penryn	4	45 nm	August 2008
Core 2 Extreme	Conroe XE Kentsfield XE Yorkfield XE	2 4 4	65 nm 65 nm 45 nm	July 2006 November 2006 November 2007	Merom XE Penryn XE Penryn XE	2 2 4	65 nm 45 nm 45 nm	July 2007 January 2008 August 2008
Core M	Desktop version not available				Broadwell	2	14 nm	September 2014
Core m3	Desktop version not available				Skylake Kaby Lake Kaby Lake	2 2 2	14 nm 14 nm 14 nm	August 2015 September 2016 April 2017
Core m5	Desktop version not available				Skylake	2	14 nm	August 2015
Core m7	Desktop version not available				Skylake	2	14 nm	August 2015
Core i3	Clarkdale Sandy Bridge Ivy Bridge Haswell Skylake Kaby Lake Coffee Lake	2 2 2 2 2 2 4	32 nm 32 nm 22 nm 22 nm 14 nm 14 nm 14 nm	January 2010 February 2011 September 2012 September 2013 September 2015 January 2017 October 2017	Arrandale Sandy Bridge Ivy Bridge Haswell Broadwell Skylake Skylake Kaby Lake Skylake Kaby Lake Kaby Lake Coffee Lake Cannon Lake Coffee Lake	2 2 2 2 2 2 2 2 2 2 2 2 2 4	32 nm 32 nm 22 nm 22 nm 14 nm 14 nm 14 nm 14 nm 14 nm 14 nm 14 nm 14 nm 10 nm 14 nm	January 2010 February 2011 June 2012 June 2013 January 2015 September 2015 June 2016 August 2016 November 2016 January 2017 June 2017 April 2018 May 2018 July 2018
Core i5	Lynnfield Clarkdale Sandy Bridge Sandy Bridge Ivy Bridge Haswell Broadwell Skylake Kaby Lake Coffee Lake	4 2 4 2 2-4 2-4 4 4 4 6	45 nm 32 nm 32 nm 32 nm 22 nm 22 nm 14 nm 14 nm 14 nm 14 nm	September 2009 January 2010 January 2011 February 2011 April 2012 June 2013 June 2015 September 2015 January 2017 October 2017	Arrandale Sandy Bridge Ivy Bridge Haswell Broadwell Skylake Kaby Lake Kaby Lake Kaby Lake-R Coffee Lake	2 2 2 2 2 2-4 2 4 4 4	32 nm 32 nm 22 nm 22 nm 14 nm 14 nm 14 nm 14 nm 14 nm 14 nm	January 2010 February 2011 May 2012 June 2013 January 2015 September 2015 August 2016 January 2017 October 2017 April 2018
Core i7	Bloomfield Lynnfield Gulftown Sandy Bridge Sandy Bridge-E Sandy Bridge-E Ivy Bridge Haswell Ivy Bridge-E Broadwell Skylake Kaby Lake Coffee Lake	4 4 6 4 6 4 4 4 4-6 4 4 4 6	45 nm 45 nm 32 nm 32 nm 32 nm 32 nm 22 nm 22 nm 22 nm 14 nm 14 nm 14 nm 14 nm	November 2008 September 2009 July 2010 January 2011 November 2011 February 2012 April 2012 June 2013 September 2013 June 2015 August 2015 January 2017 October 2017	Clarksfield Arrandale Sandy Bridge Sandy Bridge Ivy Bridge Haswell Broadwell Broadwell Skylake Kaby Lake Kaby Lake Coffee Lake	4 2 4 2 2-4 2-4 2 4 2-4 2 4 4-6	45 nm 32 nm 32 nm 32 nm 22 nm 22 nm 14 nm 14 nm 14 nm 14 nm 14 nm 14 nm	September 2009 January 2010 January 2011 February 2011 May 2012 June 2013 January 2015 June 2015 September 2015 August 2016 January 2017 April 2018
Core i7 Extreme	Bloomfield Gulftown Sandy Bridge-E Ivy Bridge-E Haswell-E Broadwell-E Skylake-X	4 6 6 6 8 10 6-8	45 nm 32 nm 32 nm 22 nm 22 nm 14 nm 14 nm	November 2008 March 2010 November 2011 September 2013 August 2014 May 2016 June 2017	Clarksfield Sandy Bridge Ivy Bridge Haswell	4 4 4 4	45 nm 32 nm 22 nm 22 nm	September 2009 January 2011 May 2012 June 2013
Core i9	Skylake-X Skylake-X Skylake-X	10 12 14-18	14 nm 14 nm 14 nm	June 2017 August 2017 September 2017	Coffee Lake-H	6	14 nm	April 2018
List of Intel Core microprocessors List of Intel Core 2 microprocessors List of Intel Core M microprocessors List of Intel Core i3 microprocessors List of Intel Core i5 microprocessors List of Intel Core i7 microprocessors List of Intel Core i9 microprocessors

Clock speed slowest 1.2 GHz to the fastest 4.2 GHz (Intel Core i7-7700K) (or 4.5 GHz via Intel Turbo Boost Technology)

Enhanced Pentium M

Main article: Enhanced Pentium M (microarchitecture)

For details about the processor core, see Yonah (microprocessor).

The original Core brand refers to Intel's 32-bit mobile dual-core x86 CPUs, which derived from the Pentium M branded processors. The processor family used an enhanced version of the Intel P6 microarchitecture. It emerged in parallel with the NetBurst microarchitecture (Intel P68) of the Pentium 4 brand, and was a precursor of the 64-bit Core microarchitecture of Core 2 branded CPUs. The Core brand comprised two branches: the Duo (dual-core) and Solo (Duo with one disabled core, which replaced the Pentium M brand of single-core mobile processor).

Intel launched the Core brand on January 6, 2006 with the release of the 32-bit Yonah CPU – Intel's first dual-core mobile (low-power) processor. Its dual-core layout closely resembled two interconnected Pentium M branded CPUs packaged as a single die (piece) silicon chip (IC). Hence, the 32-bit microarchitecture of Core branded CPUs – contrary to its name – had more in common with Pentium M branded CPUs than with the subsequent 64-bit Core microarchitecture of Core 2 branded CPUs. Despite a major rebranding effort by Intel starting January 2006, some companies continued to market computers with the Yonah core marked as Pentium M.

The Core series is also the first Intel processor used as the main CPU in an Apple Macintosh computer. The Core Duo was the CPU for the first generation MacBook Pro, while the Core Solo appeared in Apple's Mac Mini line. Core Duo signified the beginning of Apple's shift to Intel processors across their entire line.

In 2007, Intel began branding the Yonah core CPUs intended for mainstream mobile computers as Pentium Dual-Core, not to be confused with the desktop 64-bit Core microarchitecture CPUs also branded as Pentium Dual-Core.

September 2007 and January 4, 2008 marked the discontinuation of a number of Core branded CPUs including several Core Solo, Core Duo, Celeron and one Core 2 Quad chip.

Core Solo

Intel Core Solo (product code 80538) uses the same two-core die as the Core Duo, but features only one active core. Depending on demand, Intel may also simply disable one of the cores to sell the chip at the Core Solo price—this requires less effort than launching and maintaining a separate line of CPUs that physically only have one core. Intel used the same strategy previously with the 486 CPU in which early 486SX CPUs were in fact manufactured as 486DX CPUs but with the FPU disabled.

Codename (main article)	Brand name (list)	L2 Cache	Socket	TDP
Yonah	Core Solo T1xxx	2 MB	Socket M	27–31 W
	Core Solo U1xxx			5.5–6 W

Core Duo

Intel Core Duo (product code 80539) consists of two cores on one die, a 2 MB L2 cache shared by both cores, and an arbiter bus that controls both L2 cache and FSB (front-side bus) access.

Codename (main article)	Brand name (list)	L2 Cache	Socket	TDP
Yonah	Core Duo T2xxx	2 MB	Socket M	31 W
	Core Duo L2xxx			15 W
	Core Duo U2xxx			9 W

64-bit Core microarchitecture

Main article: Core (microarchitecture)

The successor to Core is the mobile version of the Intel Core 2 line of processors using cores based upon the Intel Core microarchitecture, released on July 27, 2006. The release of the mobile version of Intel Core 2 marks the reunification of Intel's desktop and mobile product lines as Core 2 processors were released for desktops and notebooks, unlike the first Intel Core CPUs that were targeted only for notebooks (although some small form factor and all-in-one desktops, like the iMac and the Mac Mini, also used Core processors).

Unlike the Intel Core, Intel Core 2 is a 64-bit processor, supporting Intel 64. Another difference between the original Core Duo and the new Core 2 Duo is an increase in the amount of Level 2 cache. The new Core 2 Duo has tripled the amount of on-board cache to 6 MB. Core 2 also introduced a quad-core performance variant to the single- and dual-core chips, branded Core 2 Quad, as well as an enthusiast variant, Core 2 Extreme. All three chips are manufactured at a 65 nm lithography, and in 2008, a 45 nm lithography and support Front Side Bus speeds ranging from 533 MHz to 1600 MHz. In addition, the 45 nm die shrink of the Core microarchitecture adds SSE4.1 support to all Core 2 microprocessors manufactured at a 45 nm lithography, therefore increasing the calculation rate of the processors.

Core 2 Solo

The Core 2 Solo, introduced in September 2007, is the successor to the Core Solo and is available only as an ultra-low-power mobile processor with 5.5 Watt thermal design power. The original U2xxx series "Merom-L" used a special version of the Merom chip with CPUID number 10661 (model 22, stepping A1) that only had a single core and was also used in some Celeron processors. The later SU3xxx are part of Intel's CULV range of processors in a smaller µFC-BGA 956 package but contain the same Penryn chip as the dual-core variants, with one of the cores disabled during manufacturing.

Codename (main article)	Brand name (list)	L2 Cache	Socket	TDP
Merom-L	Mobile Core 2 Solo U2xxx	1 MB	FCBGA	5.5 W
Penryn-L	Mobile Core 2 Solo SU3xxx	3 MB	BGA956	5.5 W

Core 2 Duo

The majority of the desktop and mobile Core 2 processor variants are Core 2 Duo with two processor cores on a single Merom, Conroe, Allendale, Penryn, or Wolfdale chip. These come in a wide range of performance and power consumption, starting with the relatively slow ultra-low-power Uxxxx (10 W) and low-power Lxxxx (17 W) versions, to the more performance oriented Pxxxx (25 W) and Txxxx (35 W) mobile versions and the Exxxx (65 W) desktop models. The mobile Core 2 Duo processors with an 'S' prefix in the name are produced in a smaller µFC-BGA 956 package, which allows building more compact laptops.

Within each line, a higher number usually refers to a better performance, which depends largely on core and front-side bus clock frequency and amount of second level cache, which are model-specific. Core 2 Duo processors typically use the full L2 cache of 2, 3, 4, or 6 MB available in the specific stepping of the chip, while versions with the amount of cache reduced during manufacturing are sold for the low-end consumer market as Celeron or Pentium Dual-Core processors. Like those processors, some low-end Core 2 Duo models disable features such as Intel Virtualization Technology.

Codename (main article)	Brand name (list)	L2 Cache	Socket	TDP
Merom	Mobile Core 2 Duo U7xxx	2 MB	BGA479	10 W
	Mobile Core 2 Duo L7xxx	4 MB		17 W
	Mobile Core 2 Duo T5xxx	2 MB	Socket M Socket P BGA479	35 W
	Mobile Core 2 Duo T7xxx	2–4 MB
Conroe and Allendale	Core 2 Duo E4xxx	2 MB	LGA 775	65 W
	Core 2 Duo E6xxx	2–4 MB
Penryn	Mobile Core 2 Duo SU7xxx	3 MB	BGA956	10 W
	Mobile Core 2 Duo SU9xxx
	Mobile Core 2 Duo SL9xxx	6 MB		17 W
	Mobile Core 2 Duo SP9xxx			25 W
	Mobile Core 2 Duo P7xxx	3 MB	Socket P FCBGA6	25 W
	Mobile Core 2 Duo P8xxx
	Mobile Core 2 Duo P9xxx	6 MB
	Mobile Core 2 Duo T6xxx	2 MB		35 W
	Mobile Core 2 Duo T8xxx	3 MB
	Mobile Core 2 Duo T9xxx	6 MB
	Mobile Core 2 Duo E8xxx	6 MB	Socket P	35-55 W
Wolfdale	Core 2 Duo E7xxx	3 MB	LGA 775	65 W
	Core 2 Duo E8xxx	6 MB

Core 2 Quad

Core 2 Quad processors are multi-chip modules consisting of two dies similar to those used in Core 2 Duo, forming a quad-core processor. This allows twice the performance of a dual-core processors at the same clock frequency in ideal conditions.

Initially, all Core 2 Quad models were versions of Core 2 Duo desktop processors, Kentsfield derived from Conroe and Yorkfield from Wolfdale, but later Penryn-QC was added as a high-end version of the mobile dual-core Penryn.

The Xeon 32xx and 33xx processors are mostly identical versions of the desktop Core 2 Quad processors and can be used interchangeably.

Codename (main article)	Brand name (list)	L2 Cache	Socket	TDP
Kentsfield	Core 2 Quad Q6xxx	2×4 MB	LGA 775	95–105 W
Yorkfield	Core 2 Quad Q8xxx	2×2 MB		65–95 W
	Core 2 Quad Q9xxx	2×3–2×6 MB
Penryn-QC	Mobile Core 2 Quad Q9xxx	2×3–2×6 MB	Socket P	45 W

Core 2 Extreme

Core 2 Extreme processors are enthusiast versions of Core 2 Duo and Core 2 Quad processors, usually with a higher clock frequency and an unlocked clock multiplier, which makes them especially attractive for overclocking. This is similar to earlier Pentium processors labeled as Extreme Edition. Core 2 Extreme processors were released at a much higher price than their regular version, often $999 or more.

Codename (main article)	Brand name (list)	L2 Cache	Socket	TDP
Merom	Mobile Core 2 Extreme X7xxx	4 MB	Socket P	44 W
Conroe	Core 2 Extreme X6xxx	4 MB	LGA 775	75 W
Kentsfield	Core 2 Extreme QX6xxx	2×4 MB	LGA 775	130 W
Penryn	Mobile Core 2 Extreme X9xxx	6 MB	Socket P	44 W
Penryn-QC	Mobile Core 2 Extreme QX9xxx	2×6 MB	Socket P	45 W
Yorkfield	Core 2 Extreme QX9xxx	2×6 MB	LGA 775 / LGA 771	130–150 W

Nehalem microarchitecture (1st generation)

Main article: Nehalem (microarchitecture)

With the release of the Nehalem microarchitecture in November 2008, Intel introduced a new naming scheme for its Core processors. There are three variants, Core i3, Core i5 and Core i7, but the names no longer correspond to specific technical features like the number of cores. Instead, the brand is now divided from low-level (i3), through mid-range (i5) to high-end performance (i7), which correspond to three, four and five stars in Intel's Intel Processor Rating following on from the entry-level Celeron (one star) and Pentium (two stars) processors. Common features of all Nehalem based processors include an integrated DDR3 memory controller as well as QuickPath Interconnect or PCI Express and Direct Media Interface on the processor replacing the aging quad-pumped Front Side Bus used in all earlier Core processors. All these processors have 256 KB L2 cache per core, plus up to 12 MB shared L3 cache. Because of the new I/O interconnect, chipsets and mainboards from previous generations can no longer be used with Nehalem-based processors.

Core i3

Intel intended the Core i3 as the new low end of the performance processor line from Intel, following the retirement of the Core 2 brand.

The first Core i3 processors were launched on January 7, 2010.

The first Nehalem based Core i3 was Clarkdale-based, with an integrated GPU and two cores. The same processor is also available as Core i5 and Pentium, with slightly different configurations.

The Core i3-3xxM processors are based on Arrandale, the mobile version of the Clarkdale desktop processor. They are similar to the Core i5-4xx series but running at lower clock speeds and without Turbo Boost. According to an Intel FAQ they do not support Error Correction Code (ECC) memory. According to motherboard manufacturer Supermicro, if a Core i3 processor is used with a server chipset platform such as Intel 3400/3420/3450, the CPU supports ECC with UDIMM. When asked, Intel confirmed that, although the Intel 5 series chipset supports non-ECC memory only with the Core i5 or i3 processors, using those processors on a motherboard with 3400 series chipsets it supports the ECC function of ECC memory. A limited number of motherboards by other companies also support ECC with Intel Core ix processors; the Asus P8B WS is an example, but it does not support ECC memory under Windows non-server operating systems.

Codename (main article)	Brand name (list)	Cores	L3 Cache	Socket	TDP	I/O Bus
Clarkdale	Core i3	2	4 MB	LGA 1156	73 W	Direct Media Interface, Integrated GPU
Arrandale	Core i3-3xxM		3 MB	rPGA-988A	35 W
	Core i3-3xxUM		3 MB	BGA-1288	18 W

Core i5

The first Core i5 using the Nehalem microarchitecture was introduced on September 8, 2009, as a mainstream variant of the earlier Core i7, the Lynnfield core. Lynnfield Core i5 processors have an 8 MB L3 cache, a DMI bus running at 2.5 GT/s and support for dual-channel DDR3-800/1066/1333 memory and have Hyper-threading disabled. The same processors with different sets of features (Hyper-Threading and other clock frequencies) enabled are sold as Core i7-8xx and Xeon 3400-series processors, which should not be confused with high-end Core i7-9xx and Xeon 3500-series processors based on Bloomfield. A new feature called Turbo Boost Technology was introduced which maximizes speed for demanding applications, dynamically accelerating performance to match the worklod.

The Core i5-5xx mobile processors are named Arrandale and based on the 32 nm Westmere shrink of the Nehalem microarchitecture. Arrandale processors have integrated graphics capability but only two processor cores. They were released in January 2010, together with Core i7-6xx and Core i3-3xx processors based on the same chip. The L3 cache in Core i5-5xx processors is reduced to 3 MB, while the Core i5-6xx uses the full cache and the Core i3-3xx does not support for Turbo Boost. Clarkdale, the desktop version of Arrandale, is sold as Core i5-6xx, along with related Core i3 and Pentium brands. It has Hyper-Threading enabled and the full 4 MB L3 cache.

According to Intel "Core i5 desktop processors and desktop boards typically do not support ECC memory", but information on limited ECC support in the Core i3 section also applies to Core i5 and i7.

Codename (main article)	Brand name (list)	Cores	L3 Cache	Socket	TDP	I/O Bus
Lynnfield	Core i5-7xx	4	8 MB	LGA 1156	95 W	Direct Media Interface
	Core i5-7xxS				82 W
Clarkdale	Core i5-6xx	2	4 MB		73–87 W	Direct Media Interface, Integrated GPU
Arrandale	Core i5-5xxM		3 MB	rPGA-988A	35 W
	Core i5-4xxM
	Core i5-5xxUM			BGA-1288	18 W
	Core i5-4xxUM

Core i7

Intel Core i7 as an Intel brand name applies to several families of desktop and laptop 64-bit x86-64 processors using the Nehalem, Westmere, Sandy Bridge, Ivy Bridge, Haswell, Broadwell, Skylake, and Kaby Lake microarchitectures. The Core i7 brand targets the business and high-end consumer markets for both desktop and laptop computers, and is distinguished from the Core i3 (entry-level consumer), Core i5 (mainstream consumer), and Xeon (server and workstation) brands.

Intel introduced the Core i7 name with the Nehalem-based Bloomfield Quad-core processor in late 2008. In 2009 new Core i7 models based on the Lynnfield (Nehalem-based) desktop quad-core processor and the Clarksfield (Nehalem-based) quad-core mobile were added, and models based on the Arrandale dual-core mobile processor (also Nehalem-based) were added in January 2010. The first six-core processor in the Core lineup is the Nehalem-based Gulftown, which was launched on March 16, 2010. Both the regular Core i7 and the Extreme Edition are advertised as five stars in the Intel Processor Rating.

In each of the first three microarchitecture generations of the brand, Core i7 has family members using two distinct system-level architectures, and therefore two distinct sockets (for example, LGA 1156 and LGA 1366 with Nehalem). In each generation, the highest-performing Core i7 processors use the same socket and QPI-based architecture as the medium-end Xeon processors of that generation, while lower-performing Core i7 processors use the same socket and PCIe/DMI/FDI architecture as the Core i5.

"Core i7" is a successor to the Intel Core 2 brand. Intel representatives stated that they intended the moniker Core i7 to help consumers decide which processor to purchase as Intel releases newer Nehalem-based products in the future.

Code name	Brand name	Cores	L3 Cache	Socket	TDP	Process	Busses	Release Date
Gulftown	Core i7-9xxX Extreme Edition	6	12 MB	LGA 1366	130 W	32 nm	QPI, 3 × DDR3	Mar 2010
	Core i7-970							Jul 2010
Bloomfield	Core i7-9xx Extreme Edition	4	8 MB			45 nm		Nov 2008
	Core i7-9xx (except Core i7-970/980)
Lynnfield	Core i7-8xx			LGA 1156	95 W		DMI, PCI-e, 2 × DDR3	Sep 2009
	Core i7-8xxS				82 W			Jan 2010
Clarksfield	Core i7-9xxXM Extreme Edition			rPGA-988A	55 W			Sep 2009
	Core i7-8xxQM				45 W
	Core i7-7xxQM		6 MB
Arrandale	Core i7-6xxM	2	4 MB		35 W	32 nm	DMI, PCI-e, FDI, 2 × DDR3	Jan 2010
	Core i7-6xxLM			BGA-1288	25 W
	Core i7-6xxUM				18 W

Sandy Bridge microarchitecture (2nd generation)

Main article: Sandy Bridge

In early 2011, Intel introduced a new microarchitecture named Sandy Bridge. This is the second generation of the Core processor microarchitecture. It kept all the existing brands from Nehalem, including Core i3/i5/i7, and introduced new model numbers. The initial set of Sandy Bridge processors includes dual- and quad-core variants, all of which use a single 32 nm die for both the CPU and integrated GPU cores, unlike the earlier microarchitectures. All Core i3/i5/i7 processors with the Sandy Bridge microarchitecture have a four-digit model number. With the mobile version, the thermal design power can no longer be determined from a one- or two-letter suffix but is encoded into the CPU number. Starting with Sandy Bridge, Intel no longer distinguishes the code names of the processor based on number of cores, socket or intended usage; they all use the same code name as the microarchitecture itself.

Ivy Bridge is the codename for Intel's 22 nm die shrink of the Sandy Bridge microarchitecture based on tri-gate ("3D") transistors, introduced in April 2012.

Core i3

Released on January 20, 2011, the Core i3-2xxx line of desktop and mobile processors is a direct replacement of the 2010 "Clarkdale" Core i3-5xx and "Arrandale" Core i3-3xxM models, based on the new microarchitecture. While they require new sockets and chipsets, the user-visible features of the Core i3 are largely unchanged, including the lack of support for Turbo Boost and AES-NI. Unlike the Sandy Bridge-based Celeron and Pentium processors, the Core i3 line does support the new Advanced Vector Extensions. This particular processor is the entry-level processor of this new series of Intel processors.

Codename (main article)	Brand name (list)	Cores	L3 Cache	Socket	TDP	I/O Bus
Sandy Bridge (Desktop)	Core i3-21xx	2	3 MB	LGA 1155	65 W	Direct Media Interface, Integrated GPU
	Core i3-21xxT				35 W
Sandy Bridge (Mobile)	Core i3-2xx0M			rPGA-988B BGA-1023
	Core i3-2xx7M			BGA-1023	17 W

Core i5

In January 2011, Intel released new quad-core Core i5 processors based on the "Sandy Bridge" microarchitecture at CES 2011. New dual-core mobile processors and desktop processors arrived in February 2011.

The Core i5-2xxx line of desktop processors are mostly quad-core chips, with the exception of the dual-core Core i5-2390T, and include integrated graphics, combining the key features of the earlier Core i5-6xx and Core i5-7xx lines. The suffix after the four-digit model number designates unlocked multiplier (K), low-power (S) and ultra-low-power (T).

The desktop CPUs now all have four non-SMT cores (like the i5-750), with the exception of the i5-2390T. The DMI bus is running at 5 GT/s.

The mobile Core i5-2xxxM processors are all dual-core and hyper-threaded chips like the previous Core i5-5xxM series, and share most of the features with that product line.

Codename (main article)	Brand name (list)	Cores	L3 Cache	Socket	TDP	I/O Bus
Sandy Bridge (Desktop)	Core i5-2xxx Core i5-2xxxK	4	6 MB	LGA 1155	95 W	Direct Media Interface, Integrated GPU
	Core i5-2xxxS				65 W
	Core i5-25xxT				45 W
	Core i5-23xxT	2	3 MB		35 W
Sandy Bridge (Mobile)	Core i5-2xxxM			rPGA-988B BGA-1023
	Core i5-2xx7M			BGA-1023	17 W

Core i7

The Core i7 brand was the high-end for Intel's desktop and mobile processors, until the announcement of the i9 in 2017. Its Sandy Bridge models feature the largest amount of L3 cache and the highest clock frequency. Most of these models are very similar to their smaller Core i5 siblings. The quad-core mobile Core i7-2xxxQM/XM processors follow the previous "Clarksfield" Core i7-xxxQM/XM processors, but now also include integrated graphics.

Codename (main article)	Brand name (list)	Cores	L3 Cache	Socket	TDP	Process	I/O Bus	Release Date
Sandy Bridge-E (Desktop)	Core i7-39xxX	6	15 MB	LGA 2011	130 W	32 nm	Direct Media Interface	November 2011
	Core i7-39xxK		12 MB
	Core i7-38xx	4	10 MB
Sandy Bridge (Desktop)	Core i7-2xxxK, i7-2xxx		8 MB	LGA 1155	95 W		Direct Media Interface, Integrated GPU	January 2011
	Core i7-2xxxS				65 W
Sandy Bridge (Mobile)	Core i7-2xxxXM			rPGA-988B BGA-1023	55 W
	Core i7-28xxQM				45 W
	Core i7-2xxxQE, i7-26xxQM, i7-27xxQM		6 MB
	Core i7-2xx0M	2	4 MB		35 W			February 2011
	Core i7-2xx9M			BGA-1023	25 W
	Core i7-2xx7M				17 W

Ivy Bridge microarchitecture (3rd generation)

Main article: Ivy Bridge (microarchitecture)

Ivy Bridge is the codename for a "third generation" line of processors based on the 22 nm manufacturing process developed by Intel. Mobile versions of the CPU were released on April 2012 following with desktop versions on September 2012.

Core i3

The Ivy Bridge-based Core-i3-3xxx line is a minor upgrade to 22 nm process technology and better graphics.

Codename (main article)	Brand name (list)	Cores	L3 Cache	Socket	TDP	I/O Bus
Ivy Bridge (Desktop)	Core i3-32xx	2	3 MB	LGA 1155	55 W	Direct Media Interface, Integrated GPU
	Core i3-32xxT				35 W
Ivy Bridge (Mobile)	Core i3-3xx0M			rPGA-988B BGA-1023
	Core i3-3xx7U			BGA-1023	17 W
	Core i3-3xx9Y				13 W

Core i5

Codename (main article)	Brand name (list)	Cores	L3 Cache	Socket	TDP	I/O Bus
Ivy Bridge (Desktop)	Core i5-3xxx Core i5-3xxxK	4	6 MB	LGA 1155	77 W	Direct Media Interface, Integrated GPU
	Core i5-3xxxS				65 W
	Core i5-35xxT				45 W
	Core i5-34xxT	2	3 MB		35 W
Ivy Bridge (Mobile)	Core i5-3xx0M			rPGA-988B BGA-1023
	Core i5-3xx7U			BGA-1023	17 W
	Core i5-3xx9Y				13 W

Core i7

Codename (main article)	Brand name (list)	Cores	L3 Cache	Socket	TDP	Process	I/O Bus	Release Date
Ivy Bridge-E (Desktop)	Core i7-4960X	6	15MB	LGA 2011	130 W	22 nm	Direct Media Interface	September 2013
	Core i7-4930K		12MB
	Core i7-4820K	4	10MB
Ivy Bridge (Desktop)	Core i7-37xx, i7-37xxK		8 MB	LGA 1155	77 W		Direct Media Interface, Integrated GPU	April 2012
	Core i7-37xxS				65 W
	Core i7-37xxT				45 W
Ivy Bridge (Mobile)	Core i7-3xxxXM				55 W
	Core i7-38xxQM				45 W
	Core i7-36x0QM, i7-3xx0QE, i7-36x5QM, i7-3xx5QE, i7-37xxQM		6 MB
	Core i7-3xx2QM, i7-3xx2QE				35 W
	Core i7-3xxxM	2	4 MB
	Core i7-3xxxLE				25 W
	Core i7-3xx7U, i7-3xx7UE				17 W
	Core i7-3xx9Y				13 W			January 2013

Haswell microarchitecture (4th generation)

Main article: Haswell (microarchitecture)

Haswell is the fourth generation Core processor microarchitecture, and was released in 2013.

Core i3

Codename (main article)	Brand name (list)	Cores	L3 Cache	GPU Model	Socket	TDP	Process	I/O Bus	Release Date
Haswell-DT (Desktop)	Core i3-43xx	2	4 MB	HD 4600	LGA 1150	54 W	22 nm	Direct Media Interface, Integrated GPU	September 2013
	Core i3-43xxT, Core i3-4xxxTE					35 W
	Core i3-41xx		3 MB	HD 4400		54 W
	Core i3-41xxT					35 W
Haswell-MB (Mobile)	Core i3-4xx2E			HD 4600	BGA 1364	25 W
	Core i3-4xx0E					37 W
	Core i3-4xxxM				Socket G3
	Core i3-4xx8U			Iris 5100	BGA 1168	28 W			June 2013
	Core i3-4xx0U, Core i3-4xx5U			HD 4400		15 W
	Core i3-4xxxY			HD 4200		11.5 W

Core i5

Codename (main article)	Brand name (list)	Cores	L3 Cache	GPU Model	Socket	TDP	Process	I/O Bus	Release Date
Haswell-DT (Desktop)	Core i5-4xxx, i5-46xxK	4	6 MB	HD 4600	LGA 1150	84 W	22 nm	Direct Media Interface, Integrated GPU	June 2013
	Core i5-4xxxS					65 W
	Core i5-46xxT					45 W
	Core i5-45xxT, Core i5-45xxTE	2	4 MB			35 W
	Core i5-4xxxR	4		Iris Pro 5200	BGA 1364	65 W
Haswell-MB (Mobile)	Core i5-4xxxH	2	3 MB	HD 4600		47 W			September 2013
	Core i5-4xx2E					25 W
	Core i5-4xx0E					37 W
	Core i5-4xxxM				Socket G3
	Core i5-4xx8U			Iris 5100	BGA1168	28 W			June 2013
	Core i5-4x50U			HD 5000		15 W
	Core i5-4x00U			HD 4400
	Core i5-4xxxY			HD 4200		11.5 W

Core i7

Codename (main article)	Brand name (list)	Cores	L3 Cache	GPU Model	Socket	TDP	Process	I/O Bus	Release Date
Haswell-E (Desktop)	Core i7-5960X	8	20 MB	N/A	LGA 2011-3	140 W	22 nm	Direct Media Interface	September 2014
	Core i7-5930K	6	15 MB
	Core i7-5820K
Haswell-DT (Desktop)	Core i7-47xx, i7-47xxK	4	8 MB	HD 4600	LGA 1150	84 W		Direct Media Interface, Integrated GPU	June 2013
	Core i7-47xxS					65 W
	Core i7-47x0T					45 W
	Core i7-47x5T					35 W
	Core i7-47xxR		6 MB	Iris Pro 5200	BGA 1364	65 W
Haswell-MB (Mobile)	Core i7-4x50HQ, Core i7-4x60HQ Core i7-4x50EQ, Core i7-4x60EQ					47 W
	Core i7-47x2HQ, Core i7-47x2EQ Core i7-470xHQ, Core i7-470xEQ			HD 4600		37 W 47 W
	Core i7-47x2MQ Core i7-470xMQ				Socket G3	37 W 47 W
	Core i7-49xxMQ, Core i7-4xxxXM		8 MB			57 W
	Core i7-4xxxM	2	4 MB			35 W			September 2013
	Core i7-4xx8U			Iris 5100	BGA 1168	28 W			June 2013
	Core i7-4x50U			HD 5000		15 W
	Core i7-4x00U			HD 4400
	Core i7-4xxxY			HD 4200		11.5 W

Broadwell microarchitecture (5th generation)

Main article: Broadwell (microarchitecture)

Broadwell is the fifth generation Core processor microarchitecture, and was released by Intel on September 6, 2014, and began shipping in late 2014. It is the first to use a 14 nm chip. Additionally, mobile processors were launched in January 2015 and Desktop Core i5 and i7 processors were released in June 2015.

Core i3

Codename (main article)	Brand name (list)	Cores	L3 Cache	GPU Model	Socket	TDP	Process	I/O Bus	Release Date
Broadwell-U (Mobile)	Core i3-5xx7U	2	3 MB	Iris 6100	BGA 1168	28 W	14 nm	Direct Media Interface, Integrated GPU	January 2015
	Core i3-5xx0U, Core i3-5xx5U			HD 5500		15 W

Core i5

Codename (main article)	Brand name (list)	Cores	L3 Cache	GPU Model	Socket	TDP	Process	I/O Bus	Release Date
Broadwell-DT (Desktop)	Core i5-5675C	4	4 MB	Iris 6200	LGA 1150	65 W	14 nm	Direct Media Interface, Integrated GPU	June 2015
	Core i5-5675R
	Core i5-5575R
Broadwell-U (Mobile)	Core i5-5xx7U	2	3 MB	Iris 6100	BGA 1168	28 W			January 2015
	Core i5-5x50U			HD 6000		15 W
	Core i5-5x00U			HD 5500

Core i7

Codename (main article)	Brand name (list)	Cores/Threads	L3 Cache	GPU Model	Socket	TDP	Process	I/O Bus	Release Date
Broadwell-DT (Desktop)	Core i7-5775C	4/8	6 MB	Iris 6200	LGA 1150	65 W	14 nm	Direct Media Interface, Integrated GPU	June 2015
	Core i7-5775R
Broadwell-U (Mobile)	Core i7-5xx7U	2/4	4 MB	Iris 6100	BGA 1168	28 W			January 2015
	Core i7-5x50U			HD 6000		15 W
	Core i7-5x00U			HD 5500
Broadwell-E (Desktop)	Core i7-6800K	6/12	15 MB	N/A	LGA 2011-3	140 W		Direct Media Interface	Q2'16
	Core i7-6850K
	Core i7-6900K	8/16	20 MB
	Core i7-6950X	10/20	25 MB

Core M

Codename (main article)	Brand name (list)	Cores	L3 Cache	GPU Model	Socket	TDP	Process	I/O Bus	Release Date
Broadwell-Y (Mobile)	Core M-5Yxx	2	4 MB	HD 5300	BGA 1234	4.5 W	14 nm	Direct Media Interface, Integrated GPU	September 2014

Skylake microarchitecture (6th generation)

Main article: Skylake (microarchitecture)

Skylake is the sixth generation Core processor microarchitecture, and was launched in August 2015. Being the successor to the Broadwell line, it is a redesign using the same 14 nm manufacturing process technology; however the redesign has better CPU and GPU performance and reduced power consumption. Intel also disabled overclocking non -K processors.

Core i3

Codename (main article)	Brand name	Cores/Threads	L3 Cache	GPU Model	Socket	TDP	Process	I/O Bus	Release Date
Skylake-DT (Desktop)	Core i3-6098P	2/4	3 MB	HD 510	LGA 1151	54 W	14 nm	Direct Media Interface, Integrated GPU	December 2015
	Core i3-6100			HD 530		51 W			September 2015
	Core i3-6100T					35 W
	Core i3-6300		4 MB			51 W
	Core i3-6320
	Core i3-6300T					35 W
Skylake-U (Mobile)	Core i3-6100U		3 MB	HD 520	FBGA 1356	15 W
	Core i3-6100H			HD 530		35 W
	Core i3-6167U			HD 550		28 W

Core i5

Codename (main article)	Brand name	Cores/Threads	L3 Cache	GPU Model	Socket	TDP	Process	I/O Bus	Release Date
Skylake-DT (Desktop)	Core i5-6400	4/4	6 MB	HD 530	LGA 1151	65 W	14 nm	Direct Media Interface, Integrated GPU	September 2015
	Core i5-6500
	Core i5-6600
	Core i5-6600K					91 W
	Core i5-6xx0T					35 W
	Core i5-6xx0R								June 2016
	Core i5-6402P			HD 510		65 W			December 2015
Skylake-U (Mobile)	Core i5-6200U	2/4	3 MB	HD 520	FCBGA 1356	15 W			September 2015
	Core i5-6260U		4 MB	Iris 540
	Core i5-62x7U			Iris 550		28 W
	Core i5-6300U			HD 520		15 W
	Core i5-6360U			Iris 540		9.5 W

Core i7

Codename (main article)	Brand name	Cores/Threads	L3 Cache	GPU Model	Socket	TDP	Process	I/O Bus	Release Date
Skylake-DT (Desktop)	Core i7-6700	4/8	8 MB	HD 530	LGA 1151	65 W	14 nm	Direct Media Interface, Integrated GPU	September 2015
	Core i7-6700T					35 W
	Core i7-6700K					91 W			August 2015
	Core i7-6785R			Iris Pro 580		65 W			May 2016
Skylake-U (Mobile)	Core i7-6x00U	2/4	4 MB	HD 520	FCBGA 1356	15 W			September 2015
	Core i7-6x60U			Iris 540
	Core i7-6567U			Iris 550		28 W
	Core i7-6600U			HD 520		25 W
	Core i7-6650U			Iris 540		15 W

 

Kaby Lake microarchitecture (7th generation)

Main article: Kaby Lake

Kaby Lake is the seventh generation Core processor microarchitecture, and was launched in October 2016 (mobile chips) and January 2017 (desktop chips). With the latest generation of microarchitecture, Intel decided to produce Kaby Lake processors without using their "tick tock" manufacturing and design model. Similar to Skylake, Kaby Lake processors are produced using a 14 nanometer manufacturing process technology.

Features

Built on an improved 14 nm process (14FF+), Kaby Lake features faster CPU clock speeds, clock speed changes, and higher Turbo frequencies. Beyond these process and clock speed changes, little of the CPU architecture has changed from Skylake, resulting in identical IPC.

Kaby Lake features a new graphics architecture to improve performance in 3D graphics and 4K video playback. It adds native HDCP 2.2 support, along with fixed function decode of H.264, HEVC Main and Main10/10-bit, and VP9 10-bit and 8-bit video. Hardware encode is supported for H.264, HEVC Main10/10-bit, and VP9 8-bit video. VP9 10-bit encode is not supported in hardware. OpenCL 2.1 is now supported.

Kaby Lake is the first Core architecture to support hyper-threading for the Pentium-branded desktop CPU SKU. Kaby Lake also features the first overclocking-enabled i3-branded CPU.

List of Kaby Lake processors

Features common to desktop Kaby Lake CPUs:

• LGA 1151 socket
• DMI 3.0 and PCIe 3.0 interfaces
• Dual channel memory support in the following configurations: DDR3L-1600 1.35 V (32 GiB maximum) or DDR4-2400 1.2 V (64 GiB maximum)
• A total of 16 PCIe lanes
• The Core-branded processors support the AVX2 instruction set. The Celeron and Pentium-branded ones support only SSE4.1/4.2
• 350 MHz base graphics clock rate
• No L4 cache (eDRAM).
• A release date of January 3, 2017

Desktop processors

Target segment	Cores (threads)	Processor branding and model		CPU clock rate	CPU Turbo clock rate			GPU model	Maximum GPU clock rate	L3 cache	TDP	Price (USD)
					Single core	Dual core	Quad core
Performance	4 (8)	Core i7	7700K	4.2 GHz	4.5 GHz	4.4 GHz	4.4 GHz	HD 630	1150 MHz	8 MB	91 W	$350
			7700	3.6 GHz	4.2 GHz	4.1 GHz	4.0 GHz				65 W	$312
			7700T	2.9 GHz	3.8 GHz	3.7 GHz	3.6 GHz				35 W
Mainstream	4 (4)	Core i5	7600K	3.8 GHz	4.2 GHz	4.1 GHz	4.0 GHz			6 MB	91 W	$243
			7600	3.5 GHz	4.1 GHz	4.0 GHz	3.9 GHz				65 W	$224
			7600T	2.8 GHz	3.7 GHz	3.6 GHz	3.5 GHz		1100 MHz		35 W
			7500	3.4 GHz	3.8 GHz	3.7 GHz	3.6 GHz				65 W	$202
			7500T	2.7 GHz	3.3 GHz	3.2 GHz	3.1 GHz				35 W
			7400	3.0 GHz	3.5 GHz	3.4 GHz	3.3 GHz		1000 MHz		65 W	$182
			7400T	2.4 GHz	3.0 GHz	2.9 GHz	2.7 GHz				35 W	$187
	2 (4)	Core i3	7350K	4.2 GHz	N/A				1150 MHz	4 MB	60 W	$179
			7320	4.1 GHz							51 W	$157
			7300	4.0 GHz								$147
			7300T	3.5 GHz					1100 MHz		35 W
			7100	3.9 GHz						3 MB	51 W	$117
			7100T	3.4 GHz							35 W
			7101E	3.9 GHz							54 W
			7101TE	3.4 GHz							35 W
		Pentium	G4620	3.7 GHz							51 W	$93
			G4600	3.6 GHz								$82
			G4600T	3.0 GHz					1050 MHz		35 W	$75
			G4560	3.5 GHz				HD 610			54 W	$64
			G4560T	2.9 GHz							35 W
	2 (2)	Celeron	G3950	3.0 GHz						2 MB	51 W	$52
			G3930	2.9 GHz								$42
			G3930T	2.7 GHz					1000 MHz		35 W

Mobile processors

High power

Target segment	Cores (threads)	Processor branding and model		CPU clock rate	CPU Turbo clock rate			GPU	GPU clock rate		L3 cache	L4 cache	Max. PCIe lanes	TDP	cTDP		Release date	Price (USD)
					Single core	Dual core	Quad core		Base	Max.					Up	Down
Performance	4 (8)	Core i7	7920HQ	3.1 GHz	4.1 GHz	3.9 GHz	3.7 GHz	HD 630	350 MHz	1100 MHz	8 MB	N/A	16	45 W	N/A	35 W	Q1 2017	$568
			7820HQ	2.9 GHz	3.9 GHz	3.7 GHz	3.5 GHz											$378
			7820HK
			7700HQ	2.8 GHz	3.8 GHz	3.6 GHz	3.4 GHz				6 MB
Mainstream	4 (4)	Core i5	7440HQ							1000 MHz								$250
			7300HQ	2.5 GHz	3.5 GHz	3.3 GHz	3.1 GHz
	2 (4)	Core i3	7100H	3.0 GHz	N/A					950 MHz	3 MB			35 W		N/A		$225

Low/Medium power

Target segment	Cores (threads)	Processor branding and model		CPU clock rate	CPU Turbo clock rate		GPU	GPU clock rate		L3 cache	L4 cache	Max. PCIe lanes	TDP	cTDP		Release date	Price (USD)
					Single core	Dual core		Base	Max.					Up	Down
Premium	2 (4)	Core i7	7660U	2.5 GHz	4.0 GHz	?	Iris Plus 640	300 MHz	1100 MHz	4 MB	64 MB	12	15 W	N/A	9.5 W	Q1 2017	?
			7600U	2.8 GHz	3.9 GHz		HD 620		1150 MHz		N/A			25 W	7.5 W		$393
			7567U	3.5 GHz	4.0 GHz		Iris Plus 650				64 MB		28 W	N/A	23 W		?
			7560U	2.4 GHz	3.8 GHz		Iris Plus 640		1050 MHz				15 W		9.5 W
			7500U	2.7 GHz	3.5 GHz		HD 620				N/A			25 W	7.5 W	Q3 2016	$393
			7Y75	1.3 GHz	3.6 GHz		HD 615					10	4.5 W	7 W	3.5 W
Mainstream		Core i5	7360U	2.3 GHz	3.6 GHz		Iris Plus 640		1000 MHz	4 MB	64 MB	12	15 W	N/A	9.5 W	Q1 2017	?
			7300U	2.6 GHz	3.5 GHz		HD 620		1100 MHz	3 MB	N/A	12	15 W	25 W	7.5 W		$281
			7287U	3.3 GHz	3.7 GHz		Iris Plus 650			4 MB	64 MB		28 W	N/A	23 W		?
			7267U	3.1 GHz	3.5 GHz				1050 MHz
			7260U	2.2 GHz	3.4 GHz		Iris Plus 640		950 MHz				15 W		9.5 W
			7200U	2.5 GHz	3.1 GHz		HD 620		1000 MHz	3 MB	N/A			25 W	7.5 W	Q3 2016	$281
			7Y57	1.2 GHz	3.3 GHz		HD 615		950 MHz	4 MB		10	4.5 W	7 W	3.5 W	Q1 2017
			7Y54		3.2 GHz											Q3 2016
		Core i3	7167U	2.8 GHz	N/A		Iris Plus 650		1000 MHz	3 MB	64 MB	12	28 W	N/A	23 W	Q1 2017	?
			7100U	2.4 GHz			HD 620				N/A		15 W		7.5 W	Q3 2016	$281
		Core m3	7Y30	1.0 GHz	2.6 GHz		HD 615		900 MHz		4 MB	10	4.5 W	7 W	3.5 W
			7Y32	1.1 GHz	3.0 GHz											Q2 2017

Server processors

Target segment	Cores (threads)	Processor branding and model		CPU clock rate	CPU Turbo clock rate			GPU model	EUs	GPU clock rate		L3 cache	L4 cache (eDRAM)	TDP	Release date	Price (USD)
					Single core	Dual core	Quad core			Base	Max.
Server	4 (8)	Xeon	E3-1280 v6	3.9 GHz	4.2 GHz	?	?	N/A				8 MB	N/A	72 W	Q1 2017	$612
			E3-1275 v6	3.8 GHz				HD P630	?	350 MHz	1150 MHz			73 W		$339
			E3-1270 v6					N/A						72 W		$328
			E3-1245 v6	3.7 GHz	4.1 GHz			HD P630	?	350 MHz	1150 MHz			73 W		$284
			E3-1240 v6					N/A						72 W		$272
			E3-1230 v6	3.5 GHz	3.9 GHz											$250
	4 (4)		E3-1225 v6	3.3 GHz	3.7 GHz			HD P630	?	350 MHz	1150 MHz			73 W		$213
			E3-1220 v6	3.0 GHz	3.5 GHz			N/A						72 W		$193
Mobile	4 (8)		E3-1535M v6	3.1 GHz	4.2 GHz	4.1 GHz	3.9 GHz	HD P630	?	350 MHz	1100 MHz			45 W		$623
			E3-1505M v6	3.0 GHz	4.0 GHz	3.8 GHz	3.6 GHz									$434
Embedded			E3-1505L v6	2.2 GHz	3.0 GHz	?	?				1000 MHz

Kaby Lake Refresh

Processor branding	Model	Cores (threads)	CPU clock rate	CPU Turbo clock rate			GPU	GPU clock rate		L3 cache	L4 cache	Max. PCIe lanes	TDP	cTDP		Release date	Price (USD)
				Single core	Dual core	Quad core		Base	Max.					Up	Down
Core i7	8650U	4 (8)	1.9 GHz	4.2 GHz		3.9 GHz	UHD 620	300 MHz	1150 MHz	8 MB	N/A	12	15 W	25 W	10 W	Q3 2017	$409
	8550U		1.8 GHz	4.0 GHz		3.7 GHz
Core i5	8350U		1.7 GHz	3.6 GHz					1100 MHz	6 MB							$297
	8250U		1.6 GHz	3.4 GHz

Coffee Lake microarchitecture (8th generation)

Main article: Coffee Lake

Coffee Lake is the eighth generation Intel Core micro-architecture and was launched in October 2017. For the first time in the ten year history of Intel Core processors, the Coffee Lake generation features an increase in core counts across the desktop lineup of processors, a significant driver of improved performance versus previous generations despite similar per-clock performance.

Increase in number of CPU cores in Desktop Coffee Lake processors

	Kaby Lake (7th Generation)	Coffee Lake (8th Generation)
	Cores / Threads	Cores / Threads
Core i3	2 / 40	4 / 40
Core i5	4 / 40	6 / 60
Core i7	4 / 80	6 / 12

* Intel Hyper-threading capabilities allow an enabled processor to execute two threads per physical core

Coffee Lake Features

Coffee Lake features largely the same CPU core and performance per MHz as Skylake/Kaby Lake. Features specific to Coffee Lake include:

• Following similar refinements to the 14nm process in Skylake and Kaby Lake, Coffee Lake is the third 14 nm process refinement ("14nm++") and features increased transistor gate pitch for a lower current density and higher leakage transistors which allows higher peak power and higher frequency at the expense of die area and idle power.
• Coffee Lake will be used in conjunction with the 300-series chipset and is incompatible with the older 100- and 200-series chipsets.
• Increased L3 cache in accordance to the number of cores
• Increased turbo clock speeds across i5 and i7 CPUs models (increased by up to 200 MHz)
• Increased iGPU clock speeds by 50MHz
• DDR4 memory support updated for 2666MHz (for i5 and i7 parts) and 2400MHz (for i3 parts); DDR3 memory is no longer supported

List of Coffee Lake Processors

Processor branding	Model	Cores (Threads)	Base CPU clock rate	Turbo clock rate [GHz]						GPU	max GPU clock rate	L3 cache	TDP	Memory support	Price (USD)
				Number of cores used
				1	2	3	4	5	6
Core i7	8086K	6 (12)	4.0 GHz	5.0	4.6	4.5	4.4		4.3	UHD 630	1.20 GHz	12 MB	95 W	DDR4 2666	$425
	8700K		3.7 GHz	4.7											$359
	8700		3.2 GHz	4.6	4.5	4.4	4.3						65 W		$303
	8700T		2.4 GHz	4.0	3.9 or 4.0 ?	3.9		3.8					35 W
Core i5	8600K	6 (6)	3.6 GHz	4.3	4.2			4.1			1.15 GHz	9 MB	95 W		$257
	8600		3.1 GHz										65 W		$213
	8600T		2.3 GHz	3.7	3.6			3.5					35 W
	8500		3.0 GHz	4.1	4.0			3.9			1.10 GHz		65 W		$192
	8500T		2.1 GHz	3.5	3.4	3.3		3.2					35 W
	8400		2.8 GHz	4.0	3.9			3.8			1.05 GHz		65 W		$182
	8400T		1.7 GHz	3.3	3.2	3.1		3.0					35 W
Core i3	8350K	4 (4)	4.0 GHz	N/A							1.15 GHz	8 MB	91 W	DDR4 2400	$168
	8300		3.7 GHz										62 W		$138
	8300T		3.2 GHz										35 W
	8100		3.6 GHz								1.10 GHz	6 MB	65 W		$117
	8100T		3.1 GHz										35 W
Pentium Gold	G5600	2 (4)	3.9 GHz									4 MB	54 W		$86
	G5500		3.8 GHz												$75
	G5500T		3.2 GHz										35 W
	G5400		3.7 GHz							UHD 610	1.05 GHz		54 W		$64
	G5400T		3.1 GHz										35 W
Celeron	G4920	2 (2)	3.2 GHz									2 MB	54W		$52
	G4900		3.1 GHz												$42
	G4900T		2.9 GHz										35 W

* Processors Core i3-8100 and Core i3-8350K with stepping B0 actually belong to "Kaby Lake-S" family

Workstation processors

Processor branding	Model	Cores (Threads)	Base CPU clock rate	Turbo clock rate [GHz]						GPU	max GPU clock rate	L3 cache	TDP	Memory support	Price (USD)
				Number of cores used
				1	2	3	4	5	6
Xeon E	2186G	6 (12)	3.8 GHz	4.7	?	?	?	?	?	UHD P630	1.20 GHz	12 MB	95 W	DDR4 2666 ECC memory supported	$450
	2176G		3.7 GHz		?	?	?	?	?				80 W		$362
	2146G		3.5 GHz	4.5	?	?	?	?	?		1.15 GHz				$311
	2136		3.3 GHz		?	?	?	?	?	N/A					$284
	2126G	6 (6)			?	?	?	?	?	UHD P630	1.15 GHz				$255
	2174G	4 (8)	3.8 GHz	4.7	?	?	?	N/A			1.20 GHz	8 MB	71 W		$328
	2144G		3.6 GHz	4.5	?	?	?				1.15 GHz				$272
	2134		3.5 GHz		?	?	?			N/A					$250
	2124G	4 (4)	3.4 GHz		?	?	?			UHD P630	1.15 GHz				$213
	2124		3.3 GHz	4.3	?	?	?			N/A					$193

Mobile processors

Processor branding	Model	Cores (threads)	CPU clock rate	Max. Turbo clock rate	GPU	GPU clock rate		L3 cache	L4 cache (eDRAM)	TDP	cTDP	Price (USD)
						Base	Max.				Down
Xeon E	2186M	6 (12)	2.9 GHz	4.8 GHz	UHD P630	350 MHz	1.20 GHz	12 MB	N/A	45 W	35 W	$623
	2176M		2.7 GHz	4.4 GHz								$450
Core i9	8950HK		2.9 GHz	4.8 GHz	UHD 630	350 MHz					N/A	$583
Core i7	8850H		2.6 GHz	4.3 GHz			1.15 GHz	9 MB			35 W	$395
	8750H		2.2 GHz	4.1 GHz			1.10 GHz
	8700B		3.2 GHz	4.6 GHz			1.20 GHz	12 MB		65 W	N/A	$303
	8559U	4 (8)	2.7 GHz	4.5 GHz	Iris Plus 655	300 MHz		8 MB	128 MB	28 W	20 W	$431
Core i5	8500B	6 (6)	3.0 GHz	4.1 GHz	UHD 630	350 MHz	1.10 GHz	9 MB	N/A	65 W	N/A	$192
	8400B		2.8 GHz	4.0 GHz			1.05 GHz					$182
	8400H	4 (8)	2.5 GHz	4.2 GHz			1.10 GHz	8 MB		45 W	35 W	N/A
	8300H		2.3 GHz	4.0 GHz			1.00 GHz					$250
	8269U		2.6 GHz	4.2 GHz	Iris Plus 655	300 MHz	1.10 GHz	6 MB	128 MB	28 W	20 W	$320
	8259U		2.3 GHz	3.8 GHz			1.05 GHz					N/A
Core i3	8109U	2 (4)	3.0 GHz	3.6 GHz				4 MB				N/A
	8100H	4 (4)	3.0 GHz	N/A	UHD 630	350 MHz	1.00 GHz	6 MB	N/A	45 W	35 W	$225

Cannon Lake microarchitecture (9th generation)

Main article: Cannon Lake (microarchitecture)

Cannon Lake (formerly Skymont) is Intel's codename for the 10-nanometer die shrink of the Kaby Lake microarchitecture. As a die shrink, Cannon Lake is a new process in Intel's "Process-Architecture-Optimization" execution plan as the next step in semiconductor fabrication. Cannon Lake are the first mainstream CPUs to include the AVX-512 instruction set. In comparison to the previous generation AVX2 (AVX-256), the new generation AVX-512 most notably provides double the width of data registers and double the number of registers. These enhancements would allow for twice the number of floating point operations per register due to the increased width in addition to doubling the overall number of registers, resulting in theoretical performance improvements of up to four times the performance of AVX2.

At CES 2018, Intel announced that they had started shipping mobile Cannon Lake CPUs at the end of 2017 and that they would ramp up production in 2018. No further details were disclosed.

Mobile processors

Processor branding	Model	Cores (threads)	CPU clock rate	CPU Turbo clock rate	GPU	GPU clock rate		L3 cache	TDP	cTDP	Price (USD)
						Base	Max.			Down
Core i3	8121U	2 (4)	2.2 GHz	3.2 GHz	N/A			4 MB	15 W	N/A	?

Ice Lake microarchitecture (10th generation)

Main article: Ice Lake (microarchitecture)

Ice Lake is codename for Intel's 10th generation microarchitecture, representing an enhancement of the 'Architecture' of the preceding generation Kaby Lake/Cannon Lake processors (as specified in Intel's Process-Architecture-Optimization execution plan). With Cannon Lake having successfully moved from a 14nm to 10nm manufacturing process, Ice Lake is also expected to feature an enhanced 10nm process (10nm+).

Ice Lake will be the first Intel CPU to feature in-silicon mitigations for the hardware vulnerabilities discovered in 2017, Meltdown and Spectre. These side-channel attacks exploit branch prediction's use of speculative execution. These exploits may cause the CPU to reveal cached private information which the exploiting process is not intended to be able to access as a form of timing attack.

See also

• Intel
• Intel Core (microarchitecture)
• List of Intel graphics processing units
• List of Intel microprocessors
• List of Intel Core i3 microprocessors
• List of Intel Core i7 microprocessors
• List of Intel Core i9 microprocessors
• List of Intel chipsets

External links

Wikimedia Commons has media related to: Intel Core 2 Duo  or Intel Core 2 Quad  or Intel Core i5  or Intel Core i7

• Intel Core technical specifications at the Wayback Machine (archived August 9, 2007)
• CPU Database. TechPowerUp.
• Intel Core Duo (Yonah) Performance Preview – Part II vs AMD 64 X2 and Intel Pentium M. Anandtech.
• Intel Core i7-3960X CPU Performance Comparison.
• Intel Centrino Duo Mobile Technology papers. Intel.
• Intel Product Information, providing a list of various processor generations